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Contactless electronic identity documents (eIDs) in the form of smart cards are expected to be used for a variety of applications, including as identity cards, public transportation tickets, library cards and more. But with this broader use comes greater physical stresses and risks to the cards, according to a group consisting of Bundesdruckerei, Infineon Technologies and the Fraunhofer Institute for Reliability and Microintegration. The trio conducted a two-year research initiative, known as SeManTik, that studied the use of eIDs and developed realistic test methods and simulation models, while also exploring new methods of integrating the chip into the card body.
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